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Multi Chip Package — Ein klassisches Multi Chip Modul (MCM, manchmal auch MCP – Multi Chip Package) besteht aus mehreren einzelnen Mikrochips (bzw. Dies), die in einem gemeinsamen Gehäuse untergebracht sind und nach außen wie ein Chip aussehen, so funktionieren und… … Deutsch Wikipedia
Multi Chip Module — Ein klassisches Multi Chip Modul (MCM, manchmal auch MCP – Multi Chip Package) besteht aus mehreren einzelnen Mikrochips (bzw. Dies), die in einem gemeinsamen Gehäuse untergebracht sind und nach außen wie ein Chip aussehen, so funktionieren und… … Deutsch Wikipedia
Multi-Chip-Modul — Ein klassisches Multi Chip Modul (MCM, manchmal auch MCP von englisch Multi Chip Package) besteht aus mehreren einzelnen Mikrochips (bzw. Dice), die in einem gemeinsamen Gehäuse untergebracht sind und nach außen wie ein Chip aussehen, so… … Deutsch Wikipedia
Multi-chip module — POWER5 MCM with four processors and four 36 MB external L3 cache dies on a ceramic multi chip module. A multi chip module (MCM) is a specialized electronic package where multiple integrated circuits (ICs), semiconductor dies or other discrete… … Wikipedia
Multi-Chip Module — A Multi Chip Module (MCM) is a specialized electronic package where multiple integrated circuits (ICs), semiconductor dies or other modules are packaged in such a way as to facilitate their use as a single IC. The MCM itself will often be… … Wikipedia
Multi-core processor — Diagram of a generic dual core processor, with CPU local level 1 caches, and a shared, on die level 2 cache … Wikipedia
Multi-core — A multi core processor (or chip level multiprocessor, CMP) combines two or more independent cores into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. The individual core is normally a… … Wikipedia
Chip carrier — A standard sized 8 pin dual in line package (DIP) containing a 555 timer IC. A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or… … Wikipedia
Multi Emulator Super System — MESS redirects here. For other uses, see mess (disambiguation). MESS Developer(s) MESS Team Stable release 0.144 / November 15, 2011; 4 days ago ( … Wikipedia
System in package — A System in a Package or System in Package (SiP), also known as a Chip Stack MCM, is a number of integrated circuits enclosed in a single package or module. The SiP performs all or most of the functions of an electronic system, and are typically… … Wikipedia
Multi-site test — Multi site test, or multisite test , or concurrent test , or parallel test are all semiconductor Automatic Test Equipment (ATE) terms that generally refer to testing of multiple devices at the same time. Currently, devices refer to System on a… … Wikipedia